Mobile electronic device with enhanced chassis

ABSTRACT

A mobile electronic device  10  with an enhanced chassis is disclosed. The device  10  can include: a frame  12  including an upper portion  14  and a lower portion  16  defining a narrow profile height  18  having an open top  20  and an open bottom  22 ; the frame  12  includes an interior portion  24  configured to surround components in a predetermined arrangement and an exterior portion  26 ; the exterior portion  26  of the frame  12  being connected to a printed circuit board (PCB)  28 ; and the open top  20  being configured to receive components on the printed circuit board  28  and the open bottom  22  being configured to receive a battery  32 . Advantageously, the frame  12  height  13  provides a narrow profile structural system to securely support and connect components in connection with mobile electronic devices. Beneficially, the height is structurally passive and free from contributing to the Z dimension.

BACKGROUND OF THE INVENTION

1. Field of the Disclosure

The disclosure relates in general to improved mobile electronic devices.

2. Background Art

There is a significant market for mobile electronic devices with largeuser interfaces, durable displays and thin profiles. Many have tried toprovide such devices, but they have failed to withstand tough userenvironments.

A mobile electronic device with an enhanced chassis with minimal Zdimension, would be considered an improvement in the art.

A mobile electronic device with enhanced laminate construction withminimal Z dimension, would be considered an improvement in the art.

A mobile electronic device with an enhanced tolerance accumulator,adapted for allowing expansion or contraction as needed, would beconsidered an improvement in the art.

A mobile electronic device with an enhanced antenna farm would beconsidered an improvement in the art.

A mobile electronic device with enhanced impact absorber with improvedimpact mitigation, would be considered an improvement in the art.

Further, robust mobile electronic devices with thin profiles, that canwithstand tough user environments, would be considered an improvement inthe art.

It is therefore desirable to provide an improved mobile electronicdevice which overcomes most, if not all, of the preceding needs.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exemplary front perspective view of a mobile electronicdevice, in accordance with principles of the present invention.

FIG. 2 is an exemplary exploded view of an embodiment of the mobileelectronic device in FIG. 1, showing various components making up themobile electronic device, in accordance with principles of the presentinvention.

FIG. 3 is an exemplary rear exploded view of an embodiment of the mobileelectronic device in FIG. 1, showing various components making up themobile electronic device, in accordance with principles of the presentinvention.

FIG. 4 is an exemplary side exploded view of an embodiment of the mobileelectronic device in FIG. 1, showing various components making up themobile electronic device, in accordance with principles of the presentinvention.

FIG. 5 is an exemplary general X-sectional view of an embodiment of themobile electronic device in FIG. 10, in accordance with principles ofthe present invention.

FIG. 6 is an enlarged partial exemplary general X-sectional view of anembodiment of the mobile electronic device in FIG. 10, showing variouscomponents making up the mobile electronic device, in accordance withprinciples of the present invention.

FIG. 7 is an enlarged partial exemplary general X-sectional view of anembodiment of the mobile electronic device in FIG. 10, showing variouscomponents making up the mobile electronic device and how they could beassembled and interconnected, in accordance with principles of thepresent invention.

FIG. 8 is an enlarged partial exemplary perspective view of anembodiment of the mobile electronic device in FIG. 7, showing variouscomponents making up the mobile electronic device and how they could beassembled and interconnected, in accordance with principles of thepresent invention.

FIG. 9 is an exemplary enlarged layout view of an embodiment of themobile electronic device in FIG. 1, showing the placement of variouscomponents making up the mobile electronic device, in accordance withprinciples of the present invention.

FIG. 10 is an exemplary enlarged perspective layout view of anembodiment of the mobile electronic device in FIG. 9, showing theplacement of various components making up the mobile electronic device,in accordance with principles of the present invention.

FIG. 11 is an exemplary enlarged layout view of an embodiment of themobile electronic device in FIG. 1, showing an antenna farm and theplacement of a plurality of antennas, in accordance with principles ofthe present invention.

FIG. 12 is an exemplary enlarged-perspective layout view of anembodiment of the mobile electronic device in FIG. 11, showing anantenna farm and the placement of a plurality of antennas, in accordancewith principles of the present invention.

FIG. 13 is an enlarged partially cut-away exemplary sectional view of anembodiment of the mobile electronic device in FIG. 6, showing an impactabsorber 210 and various components making up the mobile electronicdevice, in accordance with principles of the present invention.

FIG. 14 is an exemplary rear perspective view of a mobile electronicdevice in FIG. 1, in accordance with principles of the presentinvention.

FIG. 15 is an enlarged partial exemplary general X-sectional view of anembodiment of the mobile electronic device in FIG. 10, showing variouscomponents making up the mobile electronic device without the need of ascrew attachment, in accordance with principles of the presentinvention.

FIG. 16 includes exemplary perspective views of an embodiment of themobile electronic device in FIG. 1, showing an insert molded frame withan over molded portion in one region and a second over molded portionsubstantially around the frame, in accordance with principles of thepresent invention.

FIG. 17 is an enlarged partial exemplary general X-sectional view of anembodiment of the mobile electronic device in FIG. 10, showing variouscomponents making up the mobile electronic device showing a laminationconstruction, in accordance with principles of the present invention.

FIG. 18 includes is an enlarged partial exemplary general X-sectionalview of an embodiment of the mobile electronic device in FIG. 10,showing a tolerance accumulator illustrated in a concave positionconfigured to contract with battery contraction and a second positionshowing a convex position configured to expand with battery expansion,in accordance with principles of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The following is a detailed description and explanation of the preferredembodiments of the invention and best modes for practicing theinvention.

A. Mobile Electronic Device with an Enhanced Chassis

As best shown in FIGS. 1 and 6, a mobile electronic device 10 with anenhanced chassis is shown. The device 10 can include: a frame (orchassis) 12 including an upper portion 14 and a lower portion 16defining a narrow profile height 18 having an open top 20 and an openbottom 22; the frame 12 including an interior portion 24 configured tosurround components in a predetermined arrangement and an exteriorportion 26; the exterior portion 26 of the frame 12 being connected to aprinted circuit board (PCB) 28; and the open top 20 being configured toreceive components on the printed circuit board 28 and the open bottom22 being configured to receive a battery 32. Advantageously, thisconstruction helps to provide a robust design and durable low profilemobile electronic device 10, desired by users. The frame 12 height 13(FIG. 4) provides a narrow profile structural system to securelysupport, stack and connect components in connection with mobileelectronic devices.

Beneficially, the frame 12 is structurally passive or free fromdisadvantageously contributing to the profile or overall depth in theZ-direction, as detailed herein. The frame 12 is also adapted to bepopulated with an many components as desired and can receive componentson top of each other in a stacked relationship, to provide a narrow Zdimension.

As best shown in FIGS. 3 and 6, the exterior portion 26 of the frame 12is connected to the printed circuit board 28 and a front housing 34 witha connector, shown as a screw 36, connected to an outwardly extendingflange 30 in proximity to the upper portion 14 of the frame 12. Asshould be understood, the connector can be a snap connector, screw,adhesives and the like. This structure provides ease of access, assemblyand disassembly. Beneficially, this structure provides a secure frame,printed circuit board and front housing connection that can withstandthe rough environment it will be exposed to in normal use.

As best shown in FIGS. 2, 3, 9 and 10, the exterior portion 26 of theframe 12 can be connected to the printed circuit board 28 and a fronthousing 34 with a plurality of connectors and connections 38, to providea secure interconnect around a periphery of the frame 12.

As shown in FIGS. 9 and 10, the frame 12 is generally rectangular andincludes X-Y dimensions 42 about 95 percent or less of the X-Ydimensions 44 of the printed circuit board 28 it is connected to. Theframe 12 provides enhanced structural integrity defined by its X-Ydimensions 42, as detailed herein.

As shown in FIGS. 9 and 10, the frame 12 is connected to a printedcircuit board 28, defining a reservoir area 46 configured to receivereservoir components 48. The reservoir components 48 can include chips,chips with shields, and the like on a circuit board and a battery. Inone embodiment, many of the reservoir components 48 are shielded for EMIprotection. In a preferred embodiment, the battery 32 is stacked on topof the reservoir components 48.

The frame 12 can be configured to receive reservoir components 48 and anarea outside the frame 12 defines a non-reservoir area 50 configured toreceive non-reservoir components 52. The non-reservoir components 52 caninclude irregularly shaped components, tall components, vibrators,antennas, ringers, microphones, speakers and the like, components thatare not adapted to be fit in the reservoir area 46 due to size, andcomponents better located in non-reservoir area 50, for design reasonsor aesthetic reasons. The non-reservoir area 50 can include wide andnarrow compartments 54 and 56, as shown in FIG. 10. The wide compartment54 can include a micro USB, micro HDMI, rear and front facing cameras,head set jack, flash, and the like.

Referring back to FIG. 6, the interior portion 24 includes a first wallwidth 58 in proximity to the upper portion 14 and a second wall width 60in proximity to the lower portion 16 of the frame 12. In a preferredembodiment, the first wall width 58 is greater than the second wallwidth 60, so as to accommodate components, such as shields, chips andthe like on a circuit board and a battery, respectively. In a preferredembodiment, the first wall width 58 is complementarily configured toreceive electronic components 48 and the second wall width 60 iscomplementarily configured to receive a battery 32, the electroniccomponents 48 and battery 32 can define a critical stack and narrowprofile in the Z dimension 116. Advantageously, the widths andcomplementarily configured constructions, defining a step, aredimensioned, so as to accommodate reservoir components 48 and thebattery 32 in a stacked and narrow profile relationship.

As shown in FIG. 7, the frame 12 is connected to a front housing 34including a user interface 62. The user interface 62 can include a touchscreen display 64. Users are comfortable utilizing touch screendisplays, to operate an electronic device. The touch screen display 64can include a lens 66 bonded with a bond 70 to a display 68. In apreferred embodiment, the lens 66 is bonded to the display 68 with atleast one of an Optically Clear Adhesive (OCA) and Super Viewing Resin(SVR). The lens 66 can provide a protective shield and can include aclear plastic, polycarbonate, acrylic and the like. A preferred lens 66comprises guerilla glass, known as Corning 2317 or 2318, for enhanceddurability. An Indium Tin Oxide (ITO) layer can be sputtered ordeposited on a top 76 of the display 68 or on a bottom 78 of the lens66, for providing good touch screen display characteristics. Users liketouch screen displays in electronic devices.

In FIG. 6, the frame 12 is connected to a front housing 34 viaconnection receptacle 80. This structure provides a secureinterconnection between the front housing and the rear housing at aplurality of surfaces. The front housing 34 includes an outer and lowerperiphery 82 complementarily configured to be nested with and receivedby an upper and inner periphery 84 of a rear housing 86, for minimizingprofile in the Z dimension 116. In use, when the device 10 isdisadvantageously dropped or impacted, peripheries 82 and 84, do nottouch and maintain a gap 88 for enhanced drop isolation between the userinterface 62 and rear housing, as detailed herein. Also, an uppersection 90 of the connection receptacle 80 can be adhesively 92connected to the lens 66, in one embodiment.

In a preferred embodiment, in FIG. 6, the rear housing 86 can include anouter and lower periphery 94 complementarily configured to be nestedwith and received by an upper and inner periphery 96 of a trim module98, with a gap 100. The nested construction minimizes the Z dimensionand the gap 100 provides impact isolation, as detailed herein. The trimmodule 98 can include an inner section 102 including a downwardly facinginterface 104 connected to a tolerance accumulator 106. This structureprovides a secure interconnection between the trim module 98 and thetolerance accumulator 106. These structures can be adhesively 108connected at the downwardly facing interface 104 with a channel 110.

In one embodiment, the tolerance accumulator 106 includes an innerfacing surface 112 adhesively 114 connected to a battery 32. Thisstructure provides a secure interconnection between the inner facingsurface 112 of the tolerance accumulator 106 and the battery, forminimizing the Z dimension. 116, in FIG. 6.

The mobile electronic device 10 includes at least one of: a flip phone,slider phone, portable networking device, internet communicationsdevice, clamshell device, tablet device, radio telephone, cellularphone, mobile phone, smart phone, portable gaming device, personaldigital assistant, wireless e-mail device, two-way pager, mobilecomputing device and handheld electronic device, preferably a cellularphone in the form of a smart phone or tablet, with a minimal Z dimension

In one embodiment, the front housing 34 comprises a resilient materialthat can withstand the harsh environment that it will be exposed to,such as a plastic and the like. Likewise, the rear housing 86 and trimmodule 98 can be made of a similar material. Also, the frame 12comprises a metallic material that can provide a durable chassis-likestructure and shielding that can be grounded to the printed circuitboard 28.

In one embodiment, the frame 12 includes dimensions to substantiallyencompass the battery, to provide enhanced durability, stiffness androbustness.

A mobile electronic device in accordance with claim 20 wherein the frame12 and a display 64 include similar X-Y dimensions, to provide enhancedstructural reinforcement, to help minimize possibility of damage to thedisplay.

In another embodiment, the frame 12 includes an external portion andpositioned away therefrom, are a plurality of antennas 182.Advantageously, this positioning provides enhanced RF transparency beingspaced away from frame, and yet is sufficiently close to provideportability.

In another preferred embodiment, the frame 12 is connected to a fronthousing 34, a printed circuit board 28 and a rear housing 86. Thisstructure provides a secure and durable portable device.

FIG. 15 is an alternate embodiment of a mobile electronic device 300,free of a connector screw 302, for an enhanced narrow constructionwithout the need of a screw attachment, as shown in FIG. 6

In another embodiment, the frame 12 includes an over molded structure.For example, in FIG. 16 a frame 350, such as an insert molded frame, isshown, with a partial over molded component 352 in one region and asecond over molded component 354 substantially surrounding the frame.This structure can provide enhanced interconnection of components,alignment, minimal Z profile and RF transparency.

FIG. 17 is an enlarged partial exemplary general X-sectional view of anembodiment of the mobile electronic device in FIG. 10, showing variouscomponents making up the mobile electronic device showing a laminationconstruction, as detailed below.

FIG. 18 includes is an exemplary embodiment of a tolerance accumulator500 illustrated in a concave or contracted position 504 configured tocontract with a battery in a contracted position 504 and a secondposition showing a convex or expanded position 508 configured to expandwith a battery in an expanded position 508, as detailed herein.

Advantageously, in one embodiment, a unique chassis is used with largerplanar components of a device, to provide a protective volume thataccommodate circuit components and a battery. The invention isparticularly adapted for use in a narrow profile device with minimalthickness or z-dimension.

B. Mobile Electronic Device with an Enhanced Laminate Construction

A mobile electronic device 10 with an improved laminate construction isdisclosed. As best shown in FIG. 5, the device 10 can include: a housing150 including a front housing 34 and a rear housing 86; a user interface62 connected to the front housing 34; and a stack module 152 including aprinted circuit board 28 including an outwardly facing side 154 and aninwardly facing side 156, an electronic component 48 attached to theinwardly facing side 156 and a battery 32 attached with laminate 162 tothe electronic component 48. Advantageously, this provides a robust anddurable low profile multilayer construction for use in connection withmobile electronic devices desired by users.

In a preferred embodiment, as best shown in FIG. 7, the user interface62 includes a touch screen display 64 which is preferred by many usersof electronic devices. The touch screen display 64 can include a lens 66bonded 70 to a display 68, as previously detailed. The display 64 can belocated substantially adjacent to the outwardly facing side 154 of theprinted circuit board 28, to minimize the Z dimension 116. In oneembodiment, the location can include a narrow air gap 158, oralternatively, a pad 160 can be sandwiched between the display 68 andthe outwardly facing side 154 of the printed circuit board, tocontribute to the desired narrow profile Z dimension 116. The pad 160can provide some reinforcement and the gap can provide some isolation,in the event of an undesirable bending, crushing or moderate impact.

The stack module 152 in FIG. 7 can include electronic component(s), suchas reservoir components 48 in the reservoir area 46, which can includean integrated circuit(s) reflowed to the printed circuit board 28. Thisis a common method for attaching integrated circuits, chips and the liketo printed circuit boards. As should be understood, other methods can beused. A plurality of integrated circuits shielded or unshielded, can belocated in the reservoir area 46. As is known, mobile electronic devicesuse a plurality of integrated circuits depending on the complexity ofthe device. In a preferred embodiment, a plurality of integratedcircuits are densely populated along and parallel with the printedcircuit board, for minimizing the profile in the Z dimension 116 andmaximizing space utilization in the reservoir area 46 on the printedcircuit board. Likewise, the non-reservoir area utilizes the availablespace on the PCB 28.

In a preferred embodiment, the stack module 152 includes substantiallyonly laminations and is free of connectors and structure, such asscrews, snap connectors and the like, so as to minimize the Z dimension116.

In FIG. 6, the battery 32 is adhesively attached to at least one or moreof the electronic components 48, for enhanced stability and resilience.In a preferred embodiment, the battery 32 is adhesively attached to aplurality of electronic components 48, to provide a robust multi-layerstack and minimize profile in the Z-direction. As previously detailed,the electronic components can be enclosed in a shield or can be free ofbeing enclosed in a shield, so that in the former use case the batteryis adhesively attached to the shield and in the latter use case thebattery is adhesively attached to an integrated circuit. Thisconstruction contributes to minimizing the profile in the Z directionand provides a durable connection within and along the stack module.

In FIG. 6, the battery 32 is also generally adhesively attached with anadhesive 114 to a tolerance accumulator 106. In more detail, in apreferred embodiment, the battery 32 is adhesively attached to atolerance accumulator 106 of a trim module 98 of the rear housing 86.This structure provides a secure interconnection between the battery 32and the tolerance accumulator 106. It allows the battery 32 to expandand contract in normal usage and minimize profile in the Z dimension116. The tolerance accumulator 106 and a trim module 98 of the rearhousing 86 can be adhesively connected at a downwardly facing interface104 along a channel 110 adapted to receive adhesive, for minimal profilein the Z dimension 116.

As previously stated, the mobile electronic device 10 includes at leastone of: a flip phone, slider phone, portable networking device, internetcommunications device, clamshell device, tablet device, radio telephone,cellular phone, mobile phone, smart phone, portable gaming device,personal digital assistant, wireless e-mail device, two-way pager,mobile computing device and handheld electronic device. In a preferredembodiment, the mobile electronic device 10 is at least one of acellular phone, wireless computing device and tablet, for providing thelook, feel, function and structure desired by users.

The housing 150 comprises a resilient material substantially capable ofwithstanding the harsh environment that it will be exposed to in normaluse, such as a plastic, metal and the like. Likewise, the front and rearhousings 34 and 86, trim module 98 and other components detailed herein,can include a resilient material as well.

As shown in FIG. 6, the stack module 152 can include a frame 12comprising a metallic material. Preferably, it is connected to theinwardly facing side 156 of the printed circuit board 28. The frame 12height 13 (or depth) is structurally passive or free fromdisadvantageously contributing to the profile or overall Z dimension116, as detailed previously.

As best shown in FIG. 6, the stack module 152 includes a multi-layerconstruction comprising: the printed circuit board 28, a plurality ofintegrated circuits 48 being enclosed by shields populating the printedcircuit board 28; and a battery 32 being attached to the shields. Themulti-layer construction and lamination structure can include the PCB28, reservoir components 48 including ICs, shields 49 and battery 32 andlaminations 162 and adhesive lamination 114, provide a sturdy anddurable connection and a rigid structure, while maintaining a thin Zdimension 116 desired by users.

In a preferred embodiment, the electronic component 48 in FIG. 6 and thebattery 32 are attached with laminate 162, by at least one of a bondingmaterial, liquid epoxy, adhesive, laminate, pressure sensitive adhesiveand thermal bond film. The adhesive 114 can comprise one of thesebonding materials as well. Advantageously, the adhesive 114 and laminate162 provide an attachment which can be reliably applied and issufficient to maintain a durable bond during normal use. In oneembodiment, a pressure sensitive adhesive provides these desirableattributes and can allow rework.

In one embodiment, at least one of the laminate 162 and adhesive 114 cancomprise being attached by at least one of a low tac material and hightac material. For example, the attachment material can be: a low tacmaterial such a pressure sensitive adhesive to maintain a durable bondduring normal use and allow detachment for rework, by delaminating orpeeling in a certain use case, and a high tac material for durablebonding which is resistant to detachment. For example, the battery 32may be attached to shield 49 via laminate 162 and tolerance accumulator106 via adhesive 114, with a low tac material for ease of batteryreplacement, while other attachments may not need to be detached forrework.

As shown in FIGS. 2, 3 and 10, the printed circuit board 28 extendsbeyond the stack module 152 to receive other components not in the stackmodule 152 including at least one of a micro universal serial bus, amicro high definition multimedia interface, rear facing camera, frontfacing camera, head set jack, ear piece speaker, camera flash andmicrophone. These components can be in wide or narrow compartment 54 and56, for example. These components can be tall, irregularly dimensionedor require specific placement for a particular use case, and thus maynot be adapted to being located in the stack module 152. Thesecomponents are useful in many use cases in connection with mobileelectronic devices, such as in cell phones and tablets to name a few.

The housing 150 comprises a resilient material sufficient to withstandthe harsh environment that it will be exposed to, as previouslydetailed.

In one embodiment, a laminate method for a mobile electronic device, isillustrated in FIG. 17. The method can include: providing a housingincluding a front housing 34 and a rear housing 86; providing a userinterface 62 laminated, such as shown by adhesive 92, to the fronthousing 34; and providing a stack module 152 including a printed circuitboard 28 including an outwardly facing side 154 and an inwardly facingside 156, by: laminating an electronic component 48 to the inwardlyfacing side 156; and laminating, shown as lamination 162, a battery 32to the electronic component 48.

The method can further include laminating the battery 32 to theelectronic component 48 on one side and laminating, shown as 114, thebattery 32 to a tolerance accumulator 106 on a second side.

The method can further include laminating the battery 32 to a toleranceaccumulator 106, the tolerance accumulator 106 including an inner facingsurface 112 adhesively connected, as shown as 114, to the battery 32.

The method can further include laminating, as shown as 356, a frame 12to an outer periphery 358 of an inwardly facing side 156 of the printedcircuit board 28.

The method can further include laminating, as shown as 362, an outwardlyfacing side 154 of the printed circuit board 28 to a lower portion 360of the front housing 34.

In one embodiment, the stack module includes a multi-layer constructioncomprising: the printed circuit board, a plurality of integratedcircuits being enclosed by shields populating the printed circuit board;and a battery being attached to the shields.

Advantageously, in one preferred embodiment, the unique method andlaminate construction, contributes to providing a device with minimalthickness in a z-dimension and enhanced integrity to withstand a harshuser environment it will be exposed to. This is different fromconventional devices using connectors. For example, the planarcomponents of the product may not individually provide significantrigidity or resistance to torsion. The planner layers such as the lens,circuit board, battery chassis and housing, are affixed to one anotherin a manner that provides enhanced structural integrity in a narrowprofile device.

C. Mobile Electronic Device with an Enhanced Tolerance Accumulator

A mobile electronic device 10 with an enhanced tolerance accumulator 106is disclosed. The device 10 can include: a housing 150 including a fronthousing 34 and a rear housing 86; and a user interface 62, the rearhousing 86 including a tolerance accumulator 106. Advantageously, thisconstruction provides a robust and durable low profile mobile electronicdevice, desired by users and the tolerance accumulator 106 provides adurable structure capable of expanding or contracting.

In FIG. 6, the rear housing 86 encloses a generally rectangular battery32 located adjacent to the tolerance accumulator 106. This provides arobust construction enclosing the generally rectangular battery with anarrow profile in a Z dimension 116. In FIG. 3, the toleranceaccumulator 106 includes X and Y dimensions 170 and 172 which aregreater than X and Y dimensions 174 and 176 of the generally rectangularbattery 32. This can provide a robust construction enclosing thegenerally rectangular battery 32 with a narrow profile in a Z dimension,allows expansion or swell and contraction of the tolerance accumulator106, as needed, and allows placement or replacement of the battery 32,for example.

The rear housing 86 can include a trim module 98 attached to thetolerance accumulator 106, as shown in FIG. 6. This structure providesease of assembly and disassembly, of the housing 150, rear housing 86,trim module 98 and tolerance accumulator 106.

The rear housing 86 can include a trim module 98 including a generallyrectangular channel 108 configured to receive an adhesive 108 to attachan inner facing surface 112 of the tolerance accumulator 106 to thegenerally rectangular channel 110, as shown in FIG. 6. This structuresimplifies attachment and helps to enhance a secure connection of thechannel 108 and tolerance accumulator 106. The tolerance accumulatorincludes X and Y dimensions 170 and 172 are substantially similar to Xand Y dimensions of the generally rectangular channel 110, for a secureconnection around the periphery of the rectangular channel 110.

The housing 150 includes and encloses a battery 32 adhesively attachedto the tolerance accumulator 106, for providing a sturdy narrow profilemobile electronic device. In a preferred embodiment, a trim module 98 ofthe rear housing 86 encloses a generally rectangular battery 32 locatedadjacent to the tolerance accumulator 106, as shown in FIG. 6.

The battery 32 can be adhesively attached to an inner facing surface 112of the tolerance accumulator 106, and the battery 32 includes a LithiumIon Polymer. In a preferred embodiment, a secure connection between theLithium Ion Polymer and the tolerance accumulator 106 is provided. Thisconstruction contributes to minimizing the Z dimension 116. TypicalLithium Ion Polymer batteries generally include a flimsy jelly packincluding a plastic bag with the polymer. They are often flimsy, narrowand require stiffeners. Advantageously, the tolerance accumulator 106provides a thin sheet and secure boundary enclosing and protecting aside of the Lithium Ion Polymer battery. Further, the toleranceaccumulator 106 provides a durable body-armor like fabric or skinadapted to expand or swell over time with the Lithium Ion Polymer.

In a preferred use case, the housing 150 includes a battery 32adhesively attached to an inner facing surface 112 of the toleranceaccumulator 106, the battery includes a Lithium Ion Polymer for enhancedbattery life and desired Z dimension profile.

Turning to the user interface 62, it can include a touch screen display64 connected to and partially enclosed in the front housing 34, forproviding a narrow profile and easily accessible touch screen display tooperate an electronic device, as previously detailed.

The display 68 can be located substantially adjacent to the outwardlyfacing side 154 of the printed circuit board 28 in FIG. 7. In oneembodiment, the location can include a narrow air gap 158, to contributeto a desired narrow profile. Alternatively, a pad 160 is sandwichedbetween the display 68 and the outwardly facing side 154 of the printedcircuit board 28. The pad 160 can provide some reinforcement in theevent of an undesirable impact, bending or crushing force.

The attachment adhesives and lamination materials, have been detailedpreviously, and can vary depending on the use case.

In one embodiment, the tolerance accumulator 106 comprises an aramidfiber, and preferably a para-aramid synthetic fiber, for providing adurable, resilient and flexible material. Generally, aramid fibers aredefined as a class of heat-resistant and strong synthetic fibers. Theyare used in aerospace and military applications, for ballistic ratedbody armor fabric and ballistic composites, in bicycle tires, and as anasbestos substitute. The name is a portmanteau of “aromatic polyamide”.They are fibers in which the chain molecules are highly oriented alongthe fiber axis, so the strength of the chemical bond can be exploited.

One definition for aramid fiber is a manufactured fiber in which thefiber-forming substance is a long-chain synthetic polyamide in which atleast 85% of the amide linkages, (—CO—NH—) are attached directly to twoaromatic rings.

In one embodiment, the tolerance accumulator 106 comprises a woven sheetof an aramid fiber, for providing a thin, durable, resilient andflexible material, which can be easily connected to the rear housing 86.In one embodiment, the aramid fiber can include a combination of wovenfibers, such as Kevlar with one or more of Nomex, Technora, Haracron andTwaron, for example. Aramids and para-aramid fibers can provideattractive properties, such as good strength-to-weight properties; highYoung's modulus; high tenacity; low creep; and low elongation at break(˜3.5%).

In one embodiment, the tolerance accumulator 106 comprises a fiberincluding at least one of Kevlar, Nomex, Technora, Haracron and Twaron,for providing a thin, durable, resilient and flexible material, easilyconnected to the rear housing 86. The above list is not exhaustive andthere are other similar fibers that can be used in the invention. Thesefibers can expand as the battery, such as a Lithium Ion Polymer battery,expands over time, or contract.

In more detail, Kevlar is preferred. Kevlar is the registered trademarkfor a para-aramid synthetic fiber, related to other aramids such asNomex, Heracron and Technora.

Developed at DuPont in 1965, this high strength material was firstcommercially used in the early 1970s as a replacement for steel inracing tires. Typically it is spun into ropes or fabric sheets that canbe used as such or as an ingredient in composite material components.Para-aramids, such as para-aramid fibers like Kevlar and Twaron, provideattractive properties, such as good strength-to-weight properties; highYoung's modulus; high tenacity; low creep; and low elongation at break(˜3.5%).

Currently, Kevlar has many applications, ranging from bicycle tires andracing sails to body armor because of its high tensilestrength-to-weight ratio; by this measure it can be about five timesstronger than steel on an equal weight basis. When used as a wovenmaterial, it is suitable for mooring lines and other applications. Asimilar fiber called Twaron with a similar chemical structure wasdeveloped by Akzo in the 1970s. Commercial production started in 1986,and Twaron is now manufactured by Teijin.

One of the challenges to providing a thin housing is that the batterycells expand and contract over time, based on charge, with temperaturechanges, etc. These changes in volume are typically accommodated usingspace around the battery cells. In one embodiment, advantageously, thetolerance accumulator allows the rear wall of the device to be directlyaffixed to a thin battery which in turn is directly affixed to thecircuit board assembly. The tolerance accumulator can be made very thinand can include an aramid fiber, such as Kevlar™ fiber, to provide aflexible and robust structure that allows expansion and contraction andis aesthetically pleasing.

D. Mobile Electronic Device with an Enhanced Antenna Farm

A mobile electronic device 10 with an enhanced antenna farm 180 is shownin FIGS. 11 and 12. The device 10 can include: a housing 150 including afront housing 34 and a rear housing 86; and a user interface 62, therear housing 86 includes an antenna farm 180. Advantageously, theantenna farm 180 allows wireless communication from or to multiplesources, is substantially isolated from EMI from electronic componentsin the device and can be made with a minimal Z dimension.

The antenna farm 180 includes a plurality on antennas 182 located on anouter periphery 94 of the rear housing 86, as illustrated in FIGS. 6 and11. Beneficially, this placement provides minimal loss of the radiofrequency (RF) waves being sent or received by the antennas 182 andaccommodates a narrow profile Z dimension 116.

The antenna farm 180 includes a plurality of antennas 182 located on anouter periphery 94 of the rear housing 86, each antenna including anarrow metal pattern 184, for providing desirable antennacharacteristics and a minimal Z dimension 116. In one case, each antennaincluding a narrow metal pattern 184 aligned in at least one of an Xaxis and Y axis, so as to take up minimal space requirements and minimalZ dimensions.

In one embodiment, each antenna including a narrow metal pattern 184covered by a protective coating 186 in FIG. 11. This protective coating186 can help to minimize undesirable scratching and damage to a metalantenna pattern, during assembly, disassembly and rework for example. Itcan also help to minimize undesirable delamination or separation of theantenna from the rear housing 86, during normal use. The protectivecoating varies, and can be easily applied where desired and notinterfere with the desired RF characteristics of an antenna. In oneembodiment, it can be a paint, applied over an antenna.

The plurality on antennas 182 can include at least two or more of: adiversity antenna, transceiver antenna, location antenna, WiFi antenna,Bluetooth antenna and main antenna. Having a plurality of antennas isbeneficial, so a user can communicate via any desired protocol, such asGSM, CDMA, LTE and the like. The location antenna provides navigationand tracking, Bluetooth and WiFi allows communication to accessories andlocal hot spots, for example. As is understood, the greater number ofantennas, the greater number of communication options for a user. Heavyusers like as many communication options as available. As should beunderstood, other types of antennas can be used and this is not anextensive laundry list. As shown in FIG. 12, the plurality of antennas182 includes: a diversity antenna 188, LTE transceiver antenna 190, mainantenna 192, a BT/WiFi antenna 194, diversity antenna 196 andGPS/location antenna 198. This is simply one example of a specificlayout.

The rear housing 86 includes a trim module 98 covering as least some ofthe plurality on antennas 182 located on an outer periphery 94 of therear housing 86. The trim module 98 helps to protect the antenna arm 180from damage from the outside during normal wear and tear. As shown inthe drawings, the trim module 98 and rear housing 86 are separatestructural components. These components and functions can be integratedinto a single integrated component.

The trim module 98 comprises a resilient material that allows radiofrequency signals to pass. The resilient material can include a materialsubstantially capable of withstanding the harsh environment that it willbe exposed to in normal use, such as a plastic and the like. Inaddition, the resilient material needs be chosen such that it allows RFto freely pass to and from an antenna 182 with minimal signal loss. In apreferred embodiment, the trim module comprises a polycarbonate materialwhich allows RF to freely pass to and from the antennas with minimalsignal loss and is structurally durable. The trim module 98 can includea generally rectangular dimension, for simple assembly and a narrowprofile in a Z dimension 116.

As shown in FIG. 12, the antenna farm 180 includes a plurality ofantennas 182 located on an outer and lower periphery 94 of the rearhousing 86 being sufficiently spaced from an adjacent antenna, so as tominimally interfere with an adjacent antenna. Preferably, the pluralityof antennas 182 are located on an outer periphery 94, on an edge 200.The spacing and location on an edge 200, is an attempt to provideminimal undesirable EMI to an adjacent antenna and the components withinthe frame 12.

Preferably, the antennas 182 are strategically located and substantiallyequi-spaced on each side and around the device 10, to provide asufficient distance from adjacent antennas to minimize undesirable EMIleakage to adjacent antennas.

The housing 150 includes a shield defined by the frame 12, betweenelectronic or reservoir components 48 and the antenna farm 180.Advantageously, providing shielding between certain components and theantenna farm from undesirable electromagnetic interference (EMI), isquite important in allowing the antenna farm to function as intended andcertain components to perform as intended. As is known, EMI is adisturbance that affects an electrical circuit due to eitherelectromagnetic induction or electromagnetic radiation emitted from anexternal source. The disturbance may interrupt, obstruct, or otherwisedegrade or limit the effective performance of a circuit. The source maybe any object, artificial or natural, that carries rapidly changingelectrical currents, such as an electrical circuit, an antenna, and thelike.

In a preferred embodiment, the housing 150 includes a frame 12comprising a metallic material. The frame 12 is utilized to help alignand connect components. The metal frame provides shielding and can begrounded to the printer circuit board, for improved EMI protection. Theframe 12 is connected to a printed circuit board 28, defining areservoir area 46 configured to receive reservoir components 48. Aspreviously detailed, reservoir components 48 can include chips, chipswith shields, and the like on a circuit board and a battery 32. Many ofthe reservoir components are shielded.

Providing shielding between reservoir components 48 and the antenna farm180 from undesirable EMI, is advantageous. It is also beneficial toprovide shielding in a narrow profile mobile electronic device. Theframe 12 can further include an upper portion 14 and a lower portion 16defining a narrow profile height 13 having an open top 20 and an openbottom 22, and include an interior portion 24 configured to surroundcomponents in a predetermined arrangement and the open top 20 beingconfigured to receive components 48 on the printed circuit board 28 andthe open bottom 22 being configured to receive a battery.Advantageously, this structure helps to provide a low profile mobileelectronic device with enhanced shielding.

The user interface 62 can include a touch screen display 64 connected tothe front housing 34. Users desire touch screen displays to operateelectronic devices. The mobile electronic device 10 can vary widely, aspreviously detailed, and a cell phone, wireless computing device andtablet are preferred use cases.

Among the challenges to providing a thin, densely packed wireless deviceis providing efficient antenna performance. Antenna performance has adirect impact on the user experience, both in terms of signal strengthand battery life. In one embodiment, advantageously, the antenna farmprovides a multitude of antennas positioned around the perimeter of awireless communication device, such as a phone. The antennas are mountedin a manner that enhances wireless performance and tries to avoidcontributing to the z-axis profile or thickness of the device.

E. A Mobile Electronic Device with Enhanced Impact Absorber

A mobile electronic device 10 with enhanced impact absorber isdisclosed. The device 10 can include: a housing 150 including a fronthousing 34 and a rear housing 86; and a user interface 62, the rearhousing 86 including an impact absorber 210 located on an outer mostportion of the rear housing 86. Beneficially, the impact absorber canprovide enhanced impact mitigation, as shown in FIG. 13. The impactabsorber 210 can allow a mobile electronic device to sustain an impactand mitigate damage to the housing 150 and associated componentstherein.

The impact absorber 210 is located on at least three walls for improvedimpact resistance at, at least three locations, such as at, at leasteach side wall and a bottom wall, as shown in FIGS. 2 and 3. Preferably,the impact absorber 210 is located around the entire outer portion 212,for enhanced mitigation of impact. Beneficially, an impact absorber 210located on the outer portion 212, for example, the side-most portionsand top and bottom-most portions, can allow a mobile electronic deviceto sustain a modest impact, free from permanent damage to the housingand components therein.

The impact absorber 210 includes a bumper portion 222 located on anouter most portion 212 of the impact absorber. The bumper portion 222location is strategically located to receive a majority of impacts.

The impact absorber 210 comprises a resilient and flexible material. Theresilient and flexible material can include a material substantiallycapable of withstanding the harsh environment that it will be exposed toin normal use, such as a plastic, and preferably a polycarbonate, glassfilled polycarbonite and the like, that has desirable characteristicswhich allow it to flex on modest impacts without permanent deformation,is durable, scratch resistant and is flexible and resilient on impact.

As illustrated in FIG. 13, a sectional view of the impact absorber 210is generally U-shaped and is configured to allow a threshold lateraltravel along an X direction along X axis 224. The generally U-shapeconfiguration includes a bumper portion 222 on one vertical leg and astopper 228 on a second vertical leg 230, and is configured to allow athreshold lateral travel 232 (in dashed line) parallel to a horizontalleg 234. For example, in the event of a first intermediate impact ordrop, the impact absorber 210 is configured to allow a threshold lateraltravel 232 along an X direction parallel with the X axis 224, absorbingmuch of the impact without permanent deformation. The threshold lateraltravel 232 is defined by the stopper 228 contacting a frame 12 in thehousing 150.

In the event of a second intermediate impact, more severe than thefirst, the bumper 222 receives an impact and the generally U-shapedimpact absorber 210 moves laterally until the stopper 228 contacts theframe 12. The impact absorber 210 absorbs some of the impact andtransfers some of the impact to the frame 12. In a preferred embodiment,the frame 12 is made of a metallic material and can withstand a certainthreshold impact. This impact can occur without permanent structuraldamage to the frame 12 and impact absorber 210, up to a certainthreshold based on the severity of the impact.

In one embodiment, the surface opposite the bumper 222, defined as theupper and inner periphery 84 of the rear housing 86, is free fromcontacting a flange 236 of the front housing 34. For example, in theevent of an intermediate impact, the impact absorber 210 is configuredto allow a threshold lateral travel and the outer and lower periphery 82of the front housing 34 and flange 236 do not contact the upper andinner periphery 84 of the rear housing 86, due to gap 88, thusprotecting the user interface.

The housing 150 includes a frame 12 comprising a metallic material,selects such that it can withstand a certain threshold impact, and thusprotect many components in the housing 150.

In a preferred embodiment, the impact absorber 210 includes a firststage action configured to allow a threshold lateral movement from itsoriginal at rest position upon a bumper impact 246, shown as first stageposition 240 in FIG. 13 and thereafter the impact absorber returns backto its original at rest position, whereby the impact absorber 210absorbs or retains a substantial portion of the impact force. In theevent of a more severe bumper impact at 246, the impact absorber 210includes a second stage action or position 242 configured to allow alateral movement upon bumper impact 246 of the impact absorber 210 fromits original position, the lateral movement is defined by a stopperportion 228, and thereafter the impact absorber 210 returns back to itsoriginal at rest position, whereby the impact absorber 210 transfers asubstantial portion of the impact force via the stopper portion 228 tothe frame 12. The gap 238 allows the lateral movement. And, the impactabsorber 210 substantially isolates the front cover 34 upon bumperimpact 246, due to the gap 88 and due to not contacting the front coverflange 236.

In FIG. 13, the rear housing 86 includes a trim module 98 locatedadjacent to an outer periphery 94 of the rear housing 86. The trimmodule 98 helps to reinforce a mobile electronic device from impacts.The trim module 98 can comprise a generally rectangular dimension, toreinforce the mobile electronic device.

The frame 12 is connected to a printed circuit board 28, defining areservoir area 48 configured to receive reservoir components. Thereservoir components 48 can include chips, chips with shields, and thelike on a circuit board and a battery. The impact absorber 210 and frame12 help to protect these components from certain impacts. Many detailsof the frame 12 have been previously detailed. Advantageously, thisstructure helps to provide a low profile mobile electronic device withenhanced impact resistance.

The user interface 62 includes a touch screen display 64 connected tothe front housing 34. Users like using touch screen displays 64, andproviding the impact absorber 210 with enhanced impact resistance, canhelp to protect the device 10.

A major challenge to making thinner products with large displays isaccommodating harmful forces, such as those experienced when a droppedhandset or device hits the ground.

In one embodiment, advantageously, a unique impact mitigation structureis provided that works with the chassis, to absorb certain forces anddirect them away from components to help mitigate undesirable impacts.

Among the many advantages of the mobile electronic device are: superiorcapabilities, enhanced durability and performance, enhanced Z dimension,reliability, comfortable, light weight, portable, user friendly, easy touse, economical, and attractive.

Although embodiments of the invention have been shown and described, itis to be understood that various modifications, substitutions, andrearrangements of parts, components, and/or process steps, as well asother uses of the mobile electronic device can be made by those skilledin the art without departing from the novel spirit and scope of thisinvention.

1: A mobile electronic device with enhanced chassis, comprising: a frameincluding an upper portion and a lower portion defining a narrow profileheight having an open top and an open bottom; the frame including aninterior portion configured to surround components in a predeterminedarrangement and an exterior portion; the exterior portion of the framebeing connected to a printed circuit board; and the open top beingconfigured to receive components on the printed circuit board and theopen bottom being configured to receive a battery. 2: A mobileelectronic device in accordance with claim 1 wherein the exteriorportion of the frame is connected to a printed circuit board and a fronthousing with a connector connected to an outwardly extending flange. 3:A mobile electronic device in accordance with claim 1 wherein theexterior portion of the frame is connected to a printed circuit boardand a front housing with a plurality of connectors. 4: A mobileelectronic device in accordance with claim 1 wherein the frame isgenerally rectangular and includes dimensions of about 95 percent orless of the printed circuit board it is connected to. 5: A mobileelectronic device in accordance with claim 1 wherein the frame isconnected to a printed circuit board, defining a reservoir areaconfigured to receive reservoir components. 6: A mobile electronicdevice in accordance with claim 1 wherein the frame is connected to theprinted circuit board, defining a reservoir area configured to receivereservoir components and an area outside the frame defining anon-reservoir area configured to receive non-reservoir components. 7: Amobile electronic device in accordance with claim 1 wherein the interiorportion includes a first wall width in proximity to the upper portionand a second wall width in proximity to the lower portion. 8: A mobileelectronic device in accordance with claim 1 wherein the interiorportion includes a first wall width in proximity to the upper portioncomplementarily configured to receive electronic components and a secondwall width in proximity to the lower portion complementarily configuredto receive a battery, the electronic components and battery in a stackedrelationship. 9: A mobile electronic device in accordance with claim 1wherein the frame is connected to a front housing. 10: A mobileelectronic device in accordance with claim 1 wherein the frame isconnected to a front housing including a user interface, the userinterface including a touch screen display. 11: A mobile electronicdevice in accordance with claim 1 wherein the frame is connected to afront housing including a user interface, the user interface including atouch screen display including a lens bonded to a display. 12: A mobileelectronic device in accordance with claim 1 wherein the frame isconnected to a front housing via a connection receptacle and the fronthousing includes an outer and lower periphery complementarily configuredto be nested with and received by an upper and inner periphery of a rearhousing. 13: A mobile electronic device in accordance with claim 1further comprising a rear housing including an outer and lower peripherycomplementarily configured to be nested with and received by an upperand inner periphery of a trim section. 14: A mobile electronic device inaccordance with claim 13 wherein the trim section includes an innersection including a downwardly facing interface connected to a toleranceaccumulator. 15: A mobile electronic device in accordance with claim 14wherein the tolerance accumulator includes an inner facing surfaceadhesively connected to the battery. 16: A mobile electronic device inaccordance with claim 1 wherein the mobile electronic device includes atleast one of: a flip phone, slider phone, portable networking device,internet communications device, clamshell device, tablet device, radiotelephone, cellular phone, mobile phone, smart phone, portable gamingdevice, personal digital assistant, wireless e-mail device, two-waypager, mobile computing device and handheld electronic device. 17: Amobile electronic device in accordance with claim 2 wherein the fronthousing comprises a resilient material. 18: A mobile electronic devicein accordance with claim 1 wherein the frame comprises a metallicmaterial. 19: A mobile electronic device in accordance with claim 1wherein the mobile electronic device is at least one of a cellularphone, mobile computing device and tablet. 20: A mobile electronicdevice with enhanced chassis, comprising: a frame including an upperportion and a lower portion defining a narrow profile height having anopen top and an open bottom; the frame including an interior portionconfigured to surround components in a predetermined arrangement and anexterior portion; the exterior portion of the frame being connected to aprinted circuit board with an outwardly extending flange; and the opentop being configured to receive components on the printed circuit boardand the open bottom being configured to receive a battery, wherein theframe is generally rectangular and includes overall dimensions about 95percent or less of the printed circuit board it is connected to, andwherein the frame is connected to the printed circuit board, defining areservoir area configured to receive reservoir components. 21: A mobileelectronic device in accordance with claim 20 wherein the frame includesdimensions to substantially encompass the battery. 22: A mobileelectronic device in accordance with claim 20 wherein the frame and adisplay include similar X-Y dimensions. 23: A mobile electronic devicein accordance with claim 20 wherein the frame includes an externalportion and positioned away therefrom, are a plurality of antennas. 24:A mobile electronic device in accordance with claim 20 wherein the frameis connected to a front housing, a printed circuit board and a rearhousing. 25: A mobile electronic device in accordance with claim 20wherein the frame includes an over molded structure.